Electronics component assembly



FIG. 1 is a side elevation view of a first embodiment of an electronics component package, showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a side elevation view of a second embodiment of an electronics component package, showing our new design;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a front elevation view thereof.

The broken lines depict environmental structure and form no part of the claimed design. 

The ornamental design of an electronics component assembly, as shown and described. 